e・MMC™

容量 2GB～64GB
規格 JEDEC e・MMC™ Ver.4.41規格
パッケージ 11.5x13x1.2mm, 12x16x1.2mm, 14x18x1.2mm
14x18x1.4mm
NAND タイプ MLC
電源電圧 VCCQ = 1.8 V / 3.3 V、 VCC = 3.3 V
動作温度 -25～85℃
特記事項 BOM（構成コンポーネント）、F/Wの固定
RoHSコンプライアント
32nm Lineup
P/N Density Multiple Block Write Multiple Block Read Package Size
KE4BT5D6A 32GB 14MB/s 28MB/s 169 FBGA ball
14x18x1.4mm
KE4BT4B6A 16GB 14MB/s 28MB/s 169 FBGA ball
12x16x1.2mm
KE44B-26BN/8GB 8GB 14MB/s 28MB/s 169 FBGA ball
12x16x1.2mm
KE44B-26BN/4GB 4GB 14MB/s 28MB/s 169 FBGA ball
12x16x1.2mm
KE44B-26BN/2GB 2GB 14MB/s 28MB/s 153 FBGA ball
11.5x13x1.2mm

24nm Lineup - Standard Type -
P/N Density Multiple Block Write Multiple Block Read Package Size
TBD 64GB 20MB/s 40MB/s 169 FBGA ball
14x18x1.4mm
TBD 32GB 20MB/s 40MB/s 169 FBGA ball
14x18x1.2mm
TBD 16GB 20MB/s 40MB/s 169 FBGA ball
14x18x1.2mm
TBD 16GB 20MB/s 40MB/s 169 FBGA ball
12x16x1.2mm
TBD 8GB 20MB/s 40MB/s 169 FBGA ball
14x18x1.2mm
TBD 8GB 20MB/s 40MB/s 153 FBGA ball
11.5x13x1.2mm
TBD 4GB 20MB/s 40MB/s 153 FBGA ball
11.5x13x1.2mm

24nm Lineup - Elite Type -
P/N Density Multiple Block Write Multiple Block Read Package Size
TBD 64GB 40MB/s 40MB/s 169 FBGA ball
14x18x1.4mm
TBD 32GB 40MB/s 40MB/s 169 FBGA ball
14x18x1.2mm
TBD 16GB 40MB/s 40MB/s 169 FBGA ball
14x18x1.2mm

e・MMC™ / MCP Lineup